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Sensata SOP封装测试座/老化座SOP Test &Burn-in socket

•  Zero insertion force and self–alignment of IC package for automatic loader/unloader
•  High reliability in operation with special contact design
•  Open body construction for efficient heat radiation of IC package
 
Specifications

Current Rating Max. 1 Amp
Insulation Resistance Min. 1,000 M ohm
Dielectric Strength AC 700 V-RMS / 1 Min
Initial Contact Resistance Max. 30m ohm at DC 10mA
Operating Temperature -65°C to +150°C
Durability Min. 10,000 Cycles


Pin Availability


No. of Pos. Pitch mm Package Width mil
8 1.27 173
10 1.27 224
16 1.27 320
24 0.65 236
28 0.55 8mm
28 1.27 331
32 1.27 346
32 1.27 331
28 1.27 346
32 1.27 421
32 1.27 445
32 1.27 450
36 0.80 331
No. of Pos. Pitch mm Package Width mil
40 0.80 331
40 1.27 421
40 1.27 445
40 1.27 449
42 0.80 331
44 1.27 496
44 1.27 512
44 1.27 520
44 1.27 524
64 0.80 445
64 0.80 454
64 0.80 472
70 0.50 390

NUMBERING

CSP/1 XXX/2 - XXX/3


1 = Series Name
2 = Pin Numbers
3 = Variation
Contact Finish: Gold Plating - 10µ"
Body Material: PEI Glass Filled


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